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Description

Colloidal Silica SuspensionDESCRIPTION A non crystallizing silica (SiO2) suspension stabilized at an alkaline pH value of 9. 8. The combination of very fine abrasive particles in a chemically aggressive liquid provides a Chemical Mechanical Polishing (CMP) action. Ideal for final polishing to obtain a deformation free surface. Obtain excellent results on IC cross sections, ceramics, minerals, hard steels and ductile non ferrous materials. Recommended as final polishing for EBSD

400nm-Wide-Spike @ 6µm DESCRIPTION

Multiple purchases of EVAL-PFQNM will NOT beallowed

except that it allows application of a tip bias

Veco Single Slot Grids

Replacement Glass Chamber with sealed top plate

Carbon films are thin and highly transparent to electrons

08 TO 3µm

The 50 diamond shaped holes have an alphanumeric reference system and each box is supplied with an indexed record card

Replacement Tips 2A PEEK 2 x 0

Pitch 167µm

These tips are formed from tungsten wire

Flat: 1 per SEMI Standard (flat length 57